Course Thick-Film Technology

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Responsible: Prof.Dr.Brunner

Course

Meets requirements of following modules(MID)

• in active programs
  • Ba ET2012 DIST

Course Organization

Version created 2011-10-14 VID 1 valid from SS2013 valid to

Course identifiers Long name Thick-Film Technology CID F07_ DIST CEID (exam identifier)

Contact hours per week (SWS) Lecture 2 Exercise (unsplit) 2 Exercise (split) Lab 1 Project Seminar Tutorial(voluntary)

Total contact hours Lecture 30 Exercise (unsplit) 30 Exercise (split) Lab 15 Project Seminar Tutorial (voluntary)

Max. capacity Exercise (unsplit) Exercise (split) Lab 15 Project Seminar

Total effort (hours): 150

Instruction language

• Deutsch

Study Level

• Undergraduate

Prerequisites

• Elektronik 1
• Grundgebiete der Elektrotechnik 1,2
• Physik1,2
• Elektronik 2

Textbooks, Recommended Reading

• Hybrid-Integration,Herbert Reichel, Hüthig Verlag
• Baugruppentechnologie der Elektronik, Hybridträger, Hanke,Verlag Technik

Instructors

• Prof.Dr. Michael Brunner

Supporting Scientific Staff

• Dipl.-Ing Martin Werner

Transcipt Entry

Dickschichttechnik

Assessment

Type
sSB

Total effort [hours]
Projekt	10

Frequency: 3/Jahr

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Course components

Lecture/Exercise

Objectives

Contents

• • production of thick-films circuits
    • Screen Printer
    • Screens for printing
    • pastes for Printing
    • substrates
    • programmable furnace
• • layer thickness and topography measurement with the3D-profilograph Rodenstock RM600
    • handling of Rodenstock RM-600
    • measurement of different samples
• trimming of thick-film resistances with a micro sandblaster

Acquired Skills

• • self design of thick-film circuits
  • choice of printing paste
  • to know application possibilities

Operational Competences

• • • to manage komplex work in team
      • exercises
      • to satisfy agreements and dates
    • real world systems modeling
      • thick film circuits printing
        • printing of conduction paths and resistance
        • the circuits are fired in furnace PEO601
        • place the thick-film circuits with SMD- Divices
      • measurement of thick-film thickness
        • measurement of single printed layer
        • measurement of topography of single layer

Additional Component Assessment

Type
bK	Voraussetzung für …
bÜA	unbenotet

Contribution to course grade
bK	Voraussetzung für …
bÜA	unbenotet

Frequency: 1/year

Lab

Objectives

Additional Component Assessment

Type
bK	Voraussetzung für …
bÜA	unbenotet

Contribution to course grade
bK	2-3 eTests je 20min (je 1x wiederholbar)
bÜA	unbenotet

Frequency: 1/year